Toppan’s new factory to boost Singapore’s semiconductor ecosystem
Japanese printing technologies group Toppan is investing in a new factory in Singapore to produce high-end semiconductor substrates, marking the first such facility in the country. The factory, a significant part of Japan’s largest overseas investment in a decade, will support Singapore’s move into high-growth sectors like artificial intelligence (AI) and advanced data centers.
The plant, located under Toppan’s Singapore-based subsidiary Advanced Substrate Technologies (AST), is expected to begin production by the end of 2026. The facility will focus on manufacturing flip chip ball grid array (FC-BGA) substrates, which are crucial for high-end semiconductor products like network switches and AI chips.
The facility will cover 95,000 square meters and employ over 200 engineers and technicians. Toppan is partnering with Singapore’s Economic Development Board (EDB) and JTC, with support from Broadcom, a major client for FC-BGA substrates, to ensure the factory’s success.
